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1

Effect of Cr additions on interfacial reaction between the Sn–Zn–Bi solder and Cu/electroplated Ni substrates

Jinglin Bi, Anmin Hu, Jing Hu, Tingbi Luo, Ming Li, Dali Mao

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.37 MB

english, 2011

2

Global Monsoon Dynamics and Climate Change

Zhisheng, An, Guoxiong, Wu, Jianping, Li, Youbin, Sun, Yimin, Liu, Weijian, Zhou, Yanjun, Cai, Anmin, Duan, Li, Li, Jiangyu, Mao, Hai, Cheng, Zhengguo, Shi, Liangcheng, Tan, Hong, Yan, Hong, Ao, Hong,

Journal:

Annual Review of Earth and Planetary Sciences

Year:

2015

Language:

english

File:

PDF, 2.66 MB

english, 2015

3

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - An investigation into copper oxidation behavior

Wenting Zhao,, Jiechen Wu,, Anmin Hu,, Ming Li,, Dali Mao,

Year:

2010

Language:

english

File:

PDF, 1.21 MB

english, 2010

4

Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition

Tao Hang, Anmin Hu, Huiqin Ling, Ming Li, Dali Mao

Journal:

Applied Surface Science

Year:

2010

Language:

english

File:

PDF, 833 KB

english, 2010

5

Sign-changing solutions of a class of nonlocal quasilinear elliptic boundary value problems

Anmin Mao, Shixia Luan

Journal:

Journal of Mathematical Analysis and Applications

Year:

2011

Language:

english

File:

PDF, 130 KB

english, 2011

6

Controlled crystallization of glass–ceramics with two nucleating agents

Anmin Hu, Ming Li, Dali Mao

Journal:

Materials Characterization

Year:

2009

Language:

english

File:

PDF, 383 KB

english, 2009

7

Microstructure and mechanical properties of Sn–Zn–Bi–Cr lead-free solder

Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 925 KB

english, 2012

8

Superhydrophobic nickel films fabricated by electro and electroless deposition

Feifei Tian, Anmin Hu, Ming Li, Dali Mao

Journal:

Applied Surface Science

Year:

2012

Language:

english

File:

PDF, 1012 KB

english, 2012

9

Influence of Cr alloying on the oxidation resistance of Sn–8Zn–3Bi solders

Na Huang, Anmin Hu, Ming Li, Dali Mao

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2013

Language:

english

File:

PDF, 689 KB

english, 2013

10

Structural control of a cobalt nanocone array grown by directional electrodeposition

Hang, Tao, Hu, Anmin, Li, Ming, Mao, Dali

Journal:

Year:

2010

Language:

english

File:

PDF, 335 KB

english, 2010

11

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Oxidation failure of Lead Frame Copper alloys with Surface Electroplated Pure Cu

Chen, Xi, Hu, Anmin, Li, Ming, Shen, Hong, Mao, Dali

Year:

2007

Language:

english

File:

PDF, 1.78 MB

english, 2007

12

Signed and sign-changing solutions of Kirchhoff type problems

Shao, Mengqiu, Mao, Anmin

Journal:

Journal of Fixed Point Theory and Applications

Year:

2018

Language:

english

File:

PDF, 567 KB

english, 2018

13

Influence of crystal orientation on copper oxidation failure

Jie Gao, Anmin Hu, Ming Li, Dali Mao

Journal:

Applied Surface Science

Year:

2009

Language:

english

File:

PDF, 1.14 MB

english, 2009

14

Preparation and characterization of a titanium-substituted hydroxyapatite photocatalyst

Anmin Hu, Ming Li, Chengkang Chang, Dali Mao

Journal:

Journal of Molecular Catalysis A: Chemical

Year:

2007

Language:

english

File:

PDF, 1021 KB

english, 2007

15

Periodic solutions for a class of non-autonomous Hamiltonian systems

Shixia Luan, Anmin Mao

Journal:

Nonlinear Analysis: Theory, Methods & Applications

Year:

2005

Language:

english

File:

PDF, 211 KB

english, 2005

16

Sign-changing and multiple solutions of Kirchhoff type problems without the P.S. condition

Anmin Mao, Zhitao Zhang

Journal:

Nonlinear Analysis: Theory, Methods & Applications

Year:

2009

Language:

english

File:

PDF, 629 KB

english, 2009

17

Periodic solutions of an infinite-dimensional Hamiltonian system

Anmin Mao, Shixia Luan

Journal:

Applied Mathematics and Computation

Year:

2008

Language:

english

File:

PDF, 128 KB

english, 2008

18

Critical points theorems concerning strongly indefinite functionals and infinite many periodic solutions for a class of Hamiltonian systems

Anmin Mao, Shixia Luan

Journal:

Applied Mathematics and Computation

Year:

2009

Language:

english

File:

PDF, 270 KB

english, 2009

19

On the existence of positive solutions for a class of singular boundary value problems

Anmin Mao, Shixia Luan, Yanheng Ding

Journal:

Journal of Mathematical Analysis and Applications

Year:

2004

Language:

english

File:

PDF, 144 KB

english, 2004

20

Theoretical predictive study on N7H7 hydronitrogen compounds

Shuang Mao, Xuemei Pu, Laicai Li, Ning-Bew Wong, Anmin Tian

Journal:

Journal of Molecular Structure: THEOCHEM

Year:

2008

Language:

english

File:

PDF, 384 KB

english, 2008

21

Origin of cis preference among the three isomers of 1,4-difluorobutadiene

Hai-Rong Hu, Mao-Chu Gong, Anmin Tian, Ning-Bew Wong

Journal:

International Journal of Quantum Chemistry

Year:

2003

Language:

english

File:

PDF, 137 KB

english, 2003

22

Density functional theory study on the interaction of catechin and cytosine

WanFei Cai, Shuang Mao, Shu Zhang, Fei Cao, Hong Zhang, LaiCai Li, AnMin Tian

Journal:

Science China Chemistry

Year:

2011

Language:

english

File:

PDF, 611 KB

english, 2011

23

Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

Xi Chen, Anmin Hu, Ming Li, Dali Mao

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 383 KB

english, 2009

24

Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution

Jing Hu, Tingbi Luo, Anmin Hu, Ming Li, Dali Mao

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 809 KB

english, 2011

25

Periodic solutions for a class of first order super-quadratic Hamiltonian system

Anmin Mao, Shixia Luan, Yanheng Ding

Journal:

Journal of Mathematical Analysis and Applications

Year:

2007

Language:

english

File:

PDF, 166 KB

english, 2007

26

Preparation of Whisker β-Spodumene Glass–Ceramics

Hu Anmin, Li Ming, Mao Dali

Journal:

Journal of the American Ceramic Society

Year:

2006

Language:

english

File:

PDF, 639 KB

english, 2006

27

Dimensions of Problem Gambling Behavior Associated with Purchasing Sports Lottery

Hai Li, Luke Lunhua Mao, James J. Zhang, Yin Wu, Anmin Li, Jing Chen

Journal:

Journal of Gambling Studies

Year:

2012

Language:

english

File:

PDF, 262 KB

english, 2012

28

Preparation of nanocrystals hydroxyapatite/TiO2 compound by hydrothermal treatment

Hu Anmin, Lei Tong, Li Ming, Chang Chengkang, Ling Huiqin, Mao Dali

Journal:

Applied Catalysis B: Environmental

Year:

2006

Language:

english

File:

PDF, 306 KB

english, 2006

29

Performances of CaSiO3 ceramic sintered by Spark plasma sintering

Xianghui Wan, Anmin Hu, Ming Li, Chengkang Chang, Dali Mao

Journal:

Materials Characterization

Year:

2008

Language:

english

File:

PDF, 730 KB

english, 2008

30

Depressing effect of 0.1 wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Jin Hu, Anmin Hu, Ming Li, Dali Mao

Journal:

Materials Characterization

Year:

2010

Language:

english

File:

PDF, 2.08 MB

english, 2010

31

Thermal stability and electrical characteristics of NiSi films with electroplated Ni(W) alloy

Yuhang Xin, Anmin Hu, Ming Li, Dali Mao

Journal:

Applied Surface Science

Year:

2011

Language:

english

File:

PDF, 1.35 MB

english, 2011

32

Study on the properties of Sn–9Zn–xCr lead-free solder

Xi Chen, Anmin Hu, Ming Li, Dali Mao

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 927 KB

english, 2008

33

Effect of a trace of Cr on intermetallic compound layer for tin–zinc lead-free solder joint during aging

Xi Chen, Anmin Hu, Ming Li, Dali Mao

Journal:

Journal of Alloys and Compounds

Year:

2009

Language:

english

File:

PDF, 1.44 MB

english, 2009

34

Existence of solutions of elliptic boundary value problems with mixed type nonlinearities

Anmin Mao, Yan Zhu, Shixia Luan

Journal:

Boundary Value Problems

Year:

2012

Language:

english

File:

PDF, 184 KB

english, 2012

35

New non-metallic mesoporous SBA-15 catalyst with high selectivity for the gas-phase oxidation of cyclohexylamine to cyclohexanone oxime

Zhong, Wenzhou, Mao, Liqiu, Yi, Wenjun, Kirk, Steven Robert, Yin, Dulin, Zheng, Anmin, Luo, Hean

Journal:

Catalysis Communications

Year:

2014

Language:

english

File:

PDF, 650 KB

english, 2014

36

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Superhydrophobic nickel films fabricated by electro/electroless deposition

Tian, Feifei, Hu, Anmin, Li, Ming, Mao, Dali

Year:

2011

Language:

english

File:

PDF, 1.89 MB

english, 2011

37

Oxidation of the copper alloy with pure copper plating

Liu, Yuchen, Hu, Jin, Hu, Anmin, Li, Ming, Mao, Dali

Journal:

Journal of Adhesion Science and Technology

Year:

2012

Language:

english

File:

PDF, 310 KB

english, 2012

38

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Effect of Aging on the Interfacial Reaction between Sn-9Zn-xCr Solder and Cu Substrate

Chen, Xi, Hu, Anmin, Li, Ming, Mao, Dali

Year:

2007

Language:

english

File:

PDF, 2.05 MB

english, 2007

39

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Preparation and Properties of Sn-9Zn-3Bi-Cr Based Lead-free Solder

Li, Qi, Hu, Anmin, Li, Ming, Mao, Dali

Year:

2007

Language:

english

File:

PDF, 2.91 MB

english, 2007

40

Designable fabrication of flower-like SnS2 aggregates with excellent performance in lithium-ion batteries

Ma, Jianmin, Lei, Danni, Duan, Xiaochuan, Li, Qiuhong, Wang, Taihong, Cao, Anmin, Mao, Yuhua, Zheng, Wenjun

Journal:

Year:

2012

Language:

english

File:

PDF, 565 KB

english, 2012

41

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization

Bi, Jinglin, Hu, Anmin, Li, Ming, Mao, Dali

Year:

2011

Language:

english

File:

PDF, 3.48 MB

english, 2011

42

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Electrochemical corrosion behaviour of Sn-8Zn-3Bi-XCr solder in 3.5% NaCl

Hu, Jing, Hu, Anmin, Li, Ming, Mao, Dali

Year:

2009

Language:

english

File:

PDF, 3.09 MB

english, 2009

43

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder

Wang, Huan, Hu, Anmin, Li, Chengkang Chang Ming, Mao, Dali

Year:

2007

Language:

english

File:

PDF, 2.79 MB

english, 2007

44

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - The influence of pre-heat treatment on peeling resistance of oxide film of copper alloy lead frames

Jiwang Mao,, Xi Chen,, Anmin Hu,, Ming Li,, Dali Mao,

Year:

2008

Language:

english

File:

PDF, 1.75 MB

english, 2008

45

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Microstructural evolution of Sn-9Zn-3Bi and Sn-9Zn-3Bi-0.3Cr solder under high-temperature and high-humidity conditions

Jing Hu,, Chen, Xi, Anmin Hu,, Ming Li,, Dali Mao,

Year:

2010

Language:

english

File:

PDF, 4.67 MB

english, 2010

46

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Influence of crystal orientation on the oxidation failure of copper for IC package

Jie Gao,, Anmin Hu,, Ming Li,, Dali Mao,

Year:

2008

Language:

english

File:

PDF, 1.87 MB

english, 2008

47

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Effects of Trace Element Ag on Oxidation Failure of Copper Lead Frame

Xi, Jiaqing, Li, Ming, Hu, Anmin, Shen, Hong, Mao, Dali

Year:

2006

Language:

english

File:

PDF, 4.43 MB

english, 2006

48

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder

Luo, Tingbi, Hu, Anmin, Li, Ming, Mao, Dali

Year:

2009

Language:

english

File:

PDF, 2.70 MB

english, 2009

49

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Oxidation behavior of Sn-9Zn-3Bi-xCr solders under high-temperature exposure

Hu, Jing, Hu, Anmin, Li, Ming, Mao, Dali

Year:

2011

Language:

english

File:

PDF, 2.44 MB

english, 2011

50

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition for appliance industry

Hang, Tao, Li, Ming, Hu, Anmin, Mao, Dali

Year:

2009

Language:

english

File:

PDF, 1.25 MB

english, 2009